Case Studies
| An initiative to help a global semiconductor company reduce waste delivers a 30% reduction in wafer rejection |
| The Client
Our client offers semiconductors and system solutions for automotive, industrial electronics, chip card and security as well as applications in communications. The Challenge Our client needed to enhance the yield of the semiconductor manufacturing process by reducing waste. There was high wafer rejection because of delays in the analysis of data captured from various instruments associated with wafer processing. THE SOLUTION To speed up data analysis, complex event processing of near real-time data feed from the manufacturing equipment was desired. Our solution allows for high throughput data acquisition using concurrent algorithms. The data acquisition systems gather data from equipment. This data is co-related and processed using a series of functions and algorithms. It is then analyzed for criteria to trigger corrective action from the feedback system. The real-time capture of data from all instruments uses the latest parallel processing technology and analysis is completed within a desired latency. THE benefits The solution, which uses commodity hardware and existing middleware technology, has reduced wafer reduction by 30%. |
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